Richieste IFR 2011 Roberto Calabrese Università e INFN – Ferrara Marzo 2011

Instrumented Flux Return The muon an KL detector will be built in the magnet flux return reusing the Babar iron structure with some modification. FEA calculation in progress. Modeling and FEA calculation in progress. Keep longitudinal segmentation in front of the stack to retain KL capability Two readout option are under study: 1.read one coordinate with the bar position and the other with the arrival time of the signal 2.“double coordinate layout”: orthogonal scintillator bars.

Detector simulation  A selector based on BDT algorithm is used to discriminate muons and pions  PID performance are evaluated for different iron configurations  Machine background rates on the detector are evaluated to study  the impact on detection efficiency and muon ID  the damage on the Silicon Photo-Multipliers A detailed description of hadronic interaction is needed for detector optimization and background studies. A full GEANT4 simulation has been developed for that purpose. Complete event reconstruction is implemented to evaluate the muon detection performance Pion rejection vs muon 92cm iron 82cm iron 62cm iron Neutron flux on the forward endcap

Active modules housed in light tightened boxes (aka Pizza Box) 4 Time Readout modules 4 Binary Readout modules 4 special modules to study different fibers or SiPM geometry First Test in Dec at the Fermilab Test Beam Facility with muon/pion (4-8GeV) Active Layer (“pizza box”) The Beam test of the Prototype A detector prototype has been built to test the technology on large scale and to validate simulation results Iron: 60x60x92 cm 3, 3cm gaps for the active layers Up to 9 active layers readout together (about 230 independent electronic channels) The prototype at the Fermilab Beam Test Facility

First test beam results  Preliminary results confirm the R&D performances:  detection efficiency >95%  time resolution about 1ns  Data analysis still ongoing  refine reconstruction code  study hadronic showers  evaluate muon ID performance  tune the Monte Carlo simulation  study different detector configurations Detection efficiency Time distribution Threshold (p.e) Time (10*ns) New Beam test at Fermilab in July to extend the studies al lower momentum (2-4 GeV/c)

SiPM damage and remediation – Reduction of neutron flux – Location of SiPM Electronics readout – TDC readout: meet the required specs 8 layers vs 9 layers – Comparison of performances/costs Decision to add 10 cm iron (external) to the flux return Technical choices for the TDR

Attività 2011 Simulazioni Test neutroni Analisi dati test beam, nuovo test beam Scrittura TDR Consolidamento gruppo IFR Inizio attività relative alla costruzione

IFR construction ( ) Design of electronics and mechanical parts Procurement of material (scint, fibers, SiPM, electronics,..) Infrastructures for production and assembling (fiber polishing, grooving, aluminization, glueing) Module production (assembling scintillator, fibers, SiPM bonding, light tightening,..+ electronics) QC system for all detector (in particular for SiPM and electronics) Installation (module installation, routing fibers between layers, cabling, electronics, test, QC) Commissioning

Other activities (IFR related) Design, FEA calculation of flux return Disassembly, transportation and assembly of flux return Design and construction of installation tooling Manpower for hall crew (installation)

Costi 2011 relativi all’inizio attività di costruzione produzione SiPM dedicata (produzione fatta con la massima cautela senza problemi di tempo, con qualità eccellente) (25KE PD) prove di bonding automatizzato (adattamento macchina esistente) (5 KE PD) progettazione e produzione di prototipi di piccole parti per la costruzione dei moduli (PCB, accoppiatori fibre/SiPM,..) (10KE PD) test di assemblaggio di moduli di 4 metri: servono - fibre (15 KE FE) - nuova trafila x scintillatori 1cm (30KE PD) - materiale vario (5 KE FE) sviluppo ed acquisti per la costruzione di macchine per la costruzione dei moduli (10KE FE) (5KE Inv) sviluppo e attrezzatura per caratterizzazione SiPM e QC (moduli di elettronica, cavi, connettori, pc) (10KE FE) (5KE Inv)

Elettronica: costi 2011 scheda TDC (ACAM + LAL_Orsay): 22.5KE crate VME: 8KE (Inv) prototipo di SiPM bias generator rad-tolerant con interfaccia ECS: 20KE Totale 28 KE FE Nota: nelle richieste di settembre vi era lo sviluppo di SiPM front end ASIC (25KE). Visto lo sviluppo di un chip simile in gruppo V (INFN Bari+Genova) si ritiene conveniente rimandare questa richiesta (verrà verificata se questa soluzione può essere utile ai nostri scopi).

Missioni 2011 (specifiche IFR) M.I. convener IFR 3 KE FE M.E. 24 KE FE + 19 KE PD : -convener IFR 5 KE FE -beam test a Fnal 19 KE FE + 19 KE PD (ottenuti s.j. 9KE FE + 9 KE PD)  nuove richieste 10 KE FE + 10 KE PD + sblocco s.j.

Riepilogo generale IFR nuove richieste 2011 FEPD M.I. 3 KE M.E.15 KE10 KE Consumo30 KE45 KE Inv.18 KE Totale66 KE55 KE