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16.03.2009 Udine 1 Udine – Richieste Attivamente coinvolti totali 3FTE M.P.Giordani, P.Palestri, L.Selmi A.Micelli (dottorando) A.Cristofoli (laureando – non associato) Richieste MI: 3 settimane FBK (2 settimane) FBK (2 settimane) meeting upgrade (1 settimana) meeting upgrade (1 settimana) ME: 4 mesi caratterizzazione sensori @ CERN (2mesi) partecipazione a test-beam @ CERN (2mesi) A.Micelli Sviluppo e test sensori: 10k wafer submissions & test structures
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16.03.2009 Udine 2 Udine – Attività Activity planned with FBK (G. Dalla Betta) FBK full 3D sensors 250m-thick p-type (p=2E12) substrate p- and n-type (p,n=5E19) column pitch 50m uniform p-spray isolation (p=2E16) on both sides Mainly 2D simulations (Synopsys Dessis) critical issue for breakdown behaviour –distance between p-column and n-implant at surface (15m)
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16.03.2009 Udine 3 Udine – Primi risultati First results 2D simulation on plane through p- and n-type columns plots refer to 1m-thick device slice before/after 2E16neq/cm 2 Waiting for validation data from prototypes agreement with B. Di Girolamo to use CERN pixel facilities
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16.03.2009 Udine 4 Udine – Piani per il futuro Further investigations based on 2D simulations other planes will be considered for instance: planes perpendicular to columns tuning of simulator with empirical data Perform aimed 3D simulations for instance: capacitance evaluation Expect to contribute to device optimization p-spray implant concentration/shaping superficial p- and n-doping concentration/shaping Further iterations with FBK already planned
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