RICH 17 m Beam Pipe Mirrors Separate pions from muons <1% level between 15 and 35 GeV/c Track time at 100 ps level Partecipate in the L0 trigger Neon as.

Presentazione sul tema: "RICH 17 m Beam Pipe Mirrors Separate pions from muons <1% level between 15 and 35 GeV/c Track time at 100 ps level Partecipate in the L0 trigger Neon as."— Transcript della presentazione:

1 RICH 17 m Beam Pipe Mirrors Separate pions from muons <1% level between 15 and 35 GeV/c Track time at 100 ps level Partecipate in the L0 trigger Neon as Cherenkov radiator mosaic of mirrors (17 m focal length) two spots with PM (1000 PM per spot) beam pipe passing through PM lodging disk INFN Perugia INFN Firenze CERN M.Lenti

2 RICH prototype results NIM A593 (2008) 314-318 NIM A621 (2010) 205-211 15 GeV/c 35 GeV/c  suppression: 0.7% ( 15<p<35 GeV/c) 12.9.20112M.Lenti

3 Milestones: Design for mirror support: 30.06.2011 Vessel installation ready: 30.04.2012 Mirror and PM installation complete: 2.12.2012

4 Vessel (CERN): vacuum proof ! Gas system simplified: make vacuum, then inject pure Neon 12.9.20114M.Lenti

5 12.9.20115M.Lenti Vessel tender not submitted yet (CERN responsibility)

6 Photomultipliers 1944 PM available (quality test ongoing) 2000 HV divider in preparation (custom made) PM mechanics in fabrication FE electronics in preparation 12.9.20116M.Lenti

7 RICH PMs PM Time resolution measurements made in Perugia 12.9.20117M.Lenti

8 PM HV dividers SOLDERED HV- CONNECTION TOP AND BOTTOM SMD COMPONENTS SIG OUT COAX SOLDERED HV+ (GND) COAX SHIELD AND HV+ SOLDERED TOGETHER 12.9.20118M.Lenti

9 HV Filter board SHV CONNECTOR FROM CAEN HV-PS BRACKET TO FIX BOARD TO THE 9U EMPTY CHASSIS 32 CH HV TO PMT SPACERS SUPPORT FOR SECURITY COVER 12.9.20119M.Lenti

10 Electronics chain PMT PRE_NINO NINO_CHIP TELL 62 RG174 PCB MICROSTRIP 50-52 OHM DIFFERENTIAL FOR NINO CHIP MATCHING MADISON UNIVERSAL TM CABLE FOR 130 OHM DIFFERENTIAL FOR LVDS SIGNAL VME RICH FE 32 CH BOARD GAINDIFF PCB MICROSTRIP 130 OHM DIFFERENTIAL FOR CABLE MATCHING BIPOLAR HV CABLE 50 OHM TERMINATOR VHDCI CONN 12.9.201110M.Lenti

11 FE board 340 mm 360 mm CUSTOMIZABLE FRONT END (“FE”)AREA “DAQ” AREA 8CH NINO CHIP DC/DC CONVERTER 3.3 TO 2.5V I2C CAN 8CH NINO CHIP 8CH NINO CHIP 8CH NINO CHIP MIN. 120 mm MAX. 220 mm 32 LEMO COAX SIGNAL FROM PMT 32 CHANNEL FRONT-END AREA J1 VME CONNECTOR 32 CH VHDCI CONNECTOR TO TELL62 4CH MULTIPLICITY TO TELL62 CAN BUS CONNECTORS G 12.9.201111M.Lenti

12 DAQ TEL62 board equipped with 4 HPTDC: 512 ch 4 TEL62 for all PM (2000 ch) 1 TEL62 for “multiplicity” trigger (250 ch) Perugia group works on the TEL62 fimware and trigger See M.Sozzi report for details 12.9.201112M.Lenti

13 Mirrors All mirrors ready (18 hex + 2 semi-hex), now at CERN Quality test made in Italy in may 2011 Coating to be done at CERN Mirror support system with a “dummy” mirror: hung at the center aligned with micrometric piezo.motors V.Carassiti will engeneerize the mirror support system In the fall 2011 12.9.201113M.Lenti

14 Lab’s Optical Measurements Lab 12.4.2011 Dummy Mirror in Clean Room 12.4.2011 12.9.201114M.Lenti

15 Hex10 Hex10 in Box3 (28.04.2011) Hex10 in box (29.04.2011) Hex10 in Optics Lab (29.04.2011) 12.9.201115M.Lenti

16 Hex10 Dist Laser-Mirror: 33.875 m Dist Mirror-Diode: 33.985 m Minimum: +0.6 cm R = (33.875+33.985+0.006)/2 = 33.933 m F = R/2 = 16.967 m σ X (min) = 0.20 mm σ y (min) = 0.13 mm √(σ X *σ Y )(min) = 0.12 mm Fx-Fy: +4.2 cm Horiz. Sigma Vert. Sigma Horiz.*Vert. Sigma(2) 12.9.201116M.Lenti

17 A. Cassese 12.9.201117M.Lenti

18 Mirror Support The Mirror is supported through one hole in the back where a dowel is inserted. The Mirror is falling: the dowel is touching the mirror not in the barycenter Actuating ribbon works against g and gives vertical axis alignment A second actuating ribbon at 90 deg gives the horizontal axis alignment Piezo motors are used to pull the ribbons System heavily tested in Lab in Firenze 12.9.201118M.Lenti

19 Mirror Support Panel Goal: engeneer project by the end of 2011, then go for tender (INFN responsibility) 12.9.201119M.Lenti

20 Milestones RICH 2012 Installazione dei PM e dell'elettronica di FE 31.08.2012 Installazione degli specchi 31.08.2012 12.9.201120M.Lenti

21 RICH Schedule V8.4 (baseline) Assumes Rich vessel in time for TR Very short time window To get ready for the TR Temp. installation… today 12.9.201121M.Lenti

22 RICH Schedule V8.42 (back-up) Non-conform with baseline planning TR Outside beam periods In this scenario the RICH could only be used if there is a window to prolong the TR in 2013 ! today 12.9.201122M.Lenti

23 Conclusions Lot of progress on many items of RICH Vessel production (CERN responsibility) delayed Mirror support system to be finalized The RICH is on the critical path for september 2012 technical run 12.9.201123M.Lenti

24 Richieste Firenze 2012 INTERNO Totale: 10.00 1. Riunioni con gli altri gruppi italiani di NA62 e riunioni del gruppo RICH 10.00 ESTERO Totale: 64.00 1. meeting di analisi e collaborazione al CERN: 8 MU 32.00 2. Installazione al CERN del rivelatore RICH: 4 MU 16.00 3. Technical run di NA62: 4 MU 16.00 CONSUMO Totale: 153.00 1. Electronic Pool del CERN: noleggio moduli di elettronica 20.00 2. Common Fund della collaborazione NA62 100.00 3. Metabolismo 10.00 4. Installazione al CERN del rivelatore RICH 20.00 5. Noleggio auto al CERN per l'installazione ed il technical run 3.00 APPARATI Totale: 25.00 1. Installazione e test dell'elettronica di front-end del rivelatore RICH (CORE 2012) 25.00 Totale NA62 Firenze 252.00 12.9.201124M.Lenti

25 Richieste Perugia 2012 INTERNO Totale: 18.00 1. Riunioni e attività in Italia per RICH e TDAQ (Firenze, Pisa, Frascati) 12.00 2. Riunioni in Italia 6.00 ESTERO Totale: 76.00 1. Installazione rivelatori (RICH, TDAQ): 4 m.u. 16.00 2. Commissioning run: : 6 m.u. (previsione durata run: 6 settimane) 24.00 3. Riunioni di analisi e di collaborazione (7 riunioni) al CERN o presso altre istituzioni estere, riunioni e "working group" sul rivelatore e per la preparazione del commissioning run (9 m.u.) 36.00 CONSUMO Totale: 32.50 1. Installazione rivelatori al CERN 10.00 2. Metabolismo ricerca 10.00 3. Attività TDAQ (1 PC x sviluppo firmware L0: 2k€; 2 schede di rete 10Gbit: 1k€; TDAQ spare: 1 Tel62: 3.5k€; 2 TDCB nuova produzione con cavi: 3k€; consumo di laboratorio per riutilizzo elettronica esistente di NA62 per lettura CHOD di NA48 nel commissioning run 2012: 3k€) 12.50 TRASPORTI Totale: 1.00 1. Trasporto materiale ordinato 1.00 LICENZE-SW Totale: 2.00 1. Licenze Software Altera (convenzione Università) 2.00 APPARATI Totale: 25.00 1. Completamento HV RICH (residuo CORE) 25.00 SPSERVIZI Totale: 6.00 1. Spese consumo per servizi 6.00 Totale NA62 Perugia 160.50 12.9.201125M.Lenti