Progettazione di circuiti e sistemi VLSI Anno Accademico 2011-2012 Prof. Adelio Salsano 6.3 e 8.3 Presentazione e programma del corso Prog. Circuiti e Sistemi VLSI

Programma Cenni storici. Problematiche progettuali: costi, prestazioni, potenza. Tecnologie integrate CMOS: passi progettuali, regole di layout, packaging Richiami sui componenti elementari ideali e reali. Modelli SPICE del diodo, del transistor MOS e dei componenti passivi Interconnessioni, modelli RC. Modelli SPICE delle connessioni Nanotecnologie: aspetti tecnologici e modelli

Programma (segue) Circuiti digitali elementari: inverter CMOS e transmission gate. Caratteristiche statiche e dinamiche. Potenza, energia e ritardo dei circuiti elementari Porte logiche combinatorie. Logica statica e dinamica. Prestazioni e caratteristiche Circuiti logici sequenziali. Latch e registri. Pipeline Circuiti e sistemi digitali complessi e metodologie di implementazione: processori, PLA, FPGA, standard cell Memorie statiche e dinamiche. Memorie e non volatili

Programma (segue) Affidabilità e tolleranza ai guasti dei circuiti integrati. Circuiti integrati analogici: interruttori, riferimenti di corrente e tensione, specchi di corrente, amplificatori differenziali Strumenti per la progettazione di circuiti e sistemi: linguaggi descrittivi, i principali programmi di sintesi Progettazione custom, standard cell e componenti programmabili Progettazione ad alta affidabilità e/o basso consumo

Programma Esercitazioni (segue) Sono previste esercitazioni sui seguenti temi: Programmi simulazione (LTSpice…) Calcolo parametri Progettazione digitale RTL Progetto circuiti e sistemi FPGA e Xilinx Linguaggi descrittivi Progettazione FPGA

Notizie sul corso Esercitazioni Sono previste 25 ore di esercitazioni con l’uso di software di progetto e simulazione di componenti e circuiti prevalentemente digitali. Collaboratori Prof. Stefano Bertazzoni; Salvatore Pontarelli e Marco Ottavi Materiale didattico Jan M. Rabaey, Anantha Chandrakasan, Borivoje Nikolic, “Circuiti Integrati Digitali: l’ottica del progettista”, Pearson Prentice Hall R. L. Geiger, P.E. Allen, N.R. Strader VLSI design techniques for analog and digital Circuits, Mac Graw Hill Int. Ed. Diapositive lezione e esercitazioni

Notizie sul corso (segue) ORARIO Martedì 9,30 – 11,15 Aula C8 Giovedì 9.30 – 11.15 Aula C8 Venerdì 9.30 - 11.15 Aula C1 RICEVIMENTO STUDENTI Lunedì e giovedì 15 – 16.30

What is this course/book about? Introduction to digital integrated circuits. CMOS devices and manufacturing technology. CMOS inverters and gates. Propagation delay, noise margins, and power dissipation. Sequential circuits. Arithmetic, interconnect, and memories. Programmable logic arrays. Design methodologies. What will you learn? Understanding, designing, and optimizing digital circuits with respect to different quality metrics: cost, speed, power dissipation, and reliability

The First Computer

ENIAC - The first electronic computer (1946)

The Transistor Revolution First transistor Bell Labs, 1948

The First Integrated Circuits Bipolar logic 1960’s ECL 3-input Gate Motorola 1966

Intel 4004 Micro-Processor 1971 1000 transistors 1 MHz operation

Intel Pentium (IV) microprocessor

Moore’s Law He made a prediction that semiconductor technology will double its effectiveness every 18 months In 1965, Gordon Moore noted that the number of transistors on a chip doubled every 18 to 24 months.

Moore’s Law Electronics, April 19, 1965.

Evolution in Complexity

Transistor Counts 1 Billion Transistors K 1,000,000 100,000 10,000 Pentium® III 10,000 Pentium® II Pentium® Pro 1,000 Pentium® i486 i386 100 80286 10 8086 Source: Intel 1 1975 1980 1985 1990 1995 2000 2005 2010 Projected Courtesy, Intel

Moore’s law in Microprocessors 1000 2X growth in 1.96 years! 100 10 P6 Pentium® proc Transistors (MT) 1 486 386 0.1 286 8086 8085 0.01 8080 8008 4004 0.001 1970 1980 1990 Year 2000 2010 Transistors on Lead Microprocessors double every 2 years Courtesy, Intel

Die size grows by 14% to satisfy Moore’s Law Die Size Growth 100 P6 Pentium ® proc Die size (mm) 486 10 386 286 8080 8086 8085 ~7% growth per year 8008 ~2X growth in 10 years 4004 1 1970 1980 1990 2000 2010 Year Die size grows by 14% to satisfy Moore’s Law Courtesy, Intel

Lead Microprocessors frequency doubles every 2 years 10000 Doubles every 2 years 1000 P6 100 Pentium ® proc Frequency (Mhz) 486 10 386 8085 8086 286 1 8080 8008 4004 0.1 1970 1980 1990 2000 2010 Year Lead Microprocessors frequency doubles every 2 years Courtesy, Intel

Lead Microprocessors power continues to increase Power Dissipation 100 P6 Pentium ® proc 10 486 286 Power (Watts) 8086 386 8085 1 8080 8008 4004 0.1 1971 1974 1978 1985 1992 2000 Year Lead Microprocessors power continues to increase Courtesy, Intel

Power will be a major problem 100000 18KW 5KW 10000 1.5KW 1000 500W Pentium® proc Power (Watts) 100 286 486 8086 10 386 8085 8080 8008 1 4004 0.1 1971 1974 1978 1985 1992 2000 2004 2008 Year Power delivery and dissipation will be prohibitive Courtesy, Intel

Power density too high to keep junctions at low temp 10000 Rocket Nozzle 1000 Nuclear Reactor Power Density (W/cm2) 100 8086 10 Hot Plate 4004 P6 8008 8085 386 Pentium® proc 286 486 8080 1 1970 1980 1990 2000 2010 Year Power density too high to keep junctions at low temp Courtesy, Intel

Not Only Microprocessors Analog Baseband Digital Baseband (DSP + MCU) Power Management Small Signal RF RF Cell Phone Digital Cellular Market (Phones Shipped) 1996 1997 1998 1999 2000 Units 48M 86M 162M 260M 435M (data from Texas Instruments)

Challenges in Digital Design “Microscopic Problems” • Ultra-high speed design Interconnect • Noise, Crosstalk • Reliability, Manufacturability • Power Dissipation • Clock distribution. Everything Looks a Little Different “Macroscopic Issues” • Time-to-Market • Millions of Gates • High-Level Abstractions • Reuse & IP: Portability • Predictability • etc. …and There’s a Lot of Them! ?

Complexity outpaces design productivity Productivity Trends Logic Transistor per Chip (M) 10,000,000 10,000 1,000 100 10 1 0.1 0.01 0.001 100,000,000 0.01 0.1 1 10 100 1,000 10,000 100,000 Logic Tr./Chip 1,000,000 10,000,000 Tr./Staff Month. 100,000 1,000,000 Complexity 58%/Yr. compounded 10,000 (K) Trans./Staff - Mo. Productivity 100,000 Complexity growth rate 1,000 10,000 x x 100 1,000 x x 21%/Yr. compound x x x Productivity growth rate x 10 100 1 10 2003 1981 1983 1985 1987 1989 1991 1993 1995 1997 1999 2001 2005 2007 2009 Source: Sematech Complexity outpaces design productivity Courtesy, ITRS Roadmap

Why Scaling? Technology shrinks by 0.7/generation With every generation can integrate 2x more functions per chip; chip cost does not increase significantly Cost of a function decreases by 2x But … How to design chips with more and more functions? Design engineering population does not double every two years… Hence, a need for more efficient design methods Exploit different levels of abstraction

Design Abstraction Levels SYSTEM MODULE + GATE CIRCUIT DEVICE G S D n+ n+

Design Metrics How to evaluate performance of a digital circuit (gate, block, …)? Cost Reliability Scalability Speed (delay, operating frequency) Power dissipation Energy to perform a function

Cost of Integrated Circuits NRE (non-recurrent engineering) costs design time and effort, mask generation one-time cost factor Recurrent costs silicon processing, packaging, test proportional to volume proportional to chip area

NRE Cost is Increasing

Die Cost Single die Wafer Going up to 12” (30cm) From http://www.amd.com

Cost per Transistor cost: ¢-per-transistor 1 Fabrication capital cost per transistor (Moore’s law) 0.1 0.01 0.001 0.0001 0.00001 0.000001 0.0000001 1982 1985 1988 1991 1994 1997 2000 2003 2006 2009 2012

Yield

Defects a is approximately 3

Some Examples (1994) Chip Metal layers Line width Wafer cost Def./ cm2 Area mm2 Dies/wafer Yield Die cost 386DX 2 0.90 $900 1.0 43 360 71% $4 486 DX2 3 0.80 $1200 81 181 54% $12 Power PC 601 4 $1700 1.3 121 115 28% $53 HP PA 7100 $1300 196 66 27% $73 DEC Alpha 0.70 $1500 1.2 234 53 19% $149 Super Sparc 1.6 256 48 13% $272 Pentium 1.5 296 40 9% $417

Reliability― Noise in Digital Integrated Circuits v ( t ) V DD i ( t ) Inductive coupling Capacitive coupling Power and ground noise

DC Operation Voltage Transfer Characteristic V(x) V(y) V OH OL M IH IL f V(y)=V(x) Switching Threshold Nominal Voltage Levels VOH = f(VIL) VOL = f(VIH) VM = f(V(X) per V(x) = V(y)

Mapping between analog and digital signals V IL IH in Slope = -1 OL OH out V “ 1 ” OH V IH Undefined Region V IL “ ” V OL

Definition of Noise Margins "1" V OH Noise margin high NM H V IH Undefined Region NM V L Noise margin low IL V OL "0" Gate Output Gate Input

Noise Budget Allocates gross noise margin to expected sources of noise Sources: supply noise, cross talk, interference, offset Differentiate between fixed and proportional noise sources

Key Reliability Properties Absolute noise margin values are deceptive a floating node is more easily disturbed than a node driven by a low impedance (in terms of voltage) Noise immunity is the more important metric – the capability to suppress noise sources Key metrics: Noise transfer functions, Output impedance of the driver and input impedance of the receiver;

Regenerative Property Non-Regenerative

Regenerative Property 1 2 3 4 5 6 A chain of inverters Simulated response

Fan-in and Fan-out N Fan-out N M Fan-in M

The Ideal Gate R = ¥ R = 0 Fanout = ¥ NMH = NML = VDD/2 g =  V V i o in

An Old-time Inverter 5.0 NM 4.0 3.0 2.0 V NM 1.0 0.0 1.0 2.0 3.0 4.0 H 1.0 0.0 1.0 2.0 3.0 4.0 5.0 V (V) in

Delay Definitions

Ring Oscillator T = 2 ´ t p N

A First-Order RC Network v out in C R tp = ln (2) t = 0.69 RC Important model – matches delay of inverter

Power Dissipation Instantaneous power: p(t) = v(t)i(t) = Vsupplyi(t) Peak power: Ppeak = Vsupplyipeak Average power:

Energy and Energy-Delay Power-Delay Product (PDP) = E = Energy per operation = Pav  tp Energy-Delay Product (EDP) = quality metric of gate = E  tp

A First-Order RC Network v out v in CL

Summary Digital integrated circuits have come a long way and still have quite some potential left for the coming decades Some interesting challenges ahead Getting a clear perspective on the challenges and potential solutions is the purpose of this book Understanding the design metrics that govern digital design is crucial Cost, reliability, speed, power and energy dissipation